Surface Acoustic Wave (SAW) devices are components that make use of the ability of piezoelectric materials to convert acoustic (i.e., mechanical) waves into electromagnetic signals and vice versa.   By far, the most common SAW devices are SAW Band band-pass filters (SAW BPF), which sort signals by frequency.  The most widely used substrates are quartz (SiO2), lithium niobate (LiNbO3), and Lithium tantalite (LiTaO3,) which are very brittle materials.

Major Considerations:

Cut quality:

• Chipping

Dicing Saw:

Automatic (7120 series) or fully automatic (7220 series) dicing systems enhanced process control tools with a very high automation level

Dicing Blade:

• Quartz:
  2″ Resin blades “Q”, “K” matrixes 
• Thickness: .004” – .008” (0.1 – 0.2 mm)

Process Parameters:

• Feed rate: 5 – 20 mm/sec
• Spindle speed:
  2”: 15 – 30 krpm
  4”: 8 – 15 krpm