樹脂結合劑刀片
FEATURES
RESIN BINDER
樹脂結合劑可實現刀片的磨損管理。
樹脂結合劑刀片是硬脆材料的理想選擇，
如：QFN/MLF、厚陶瓷基板、HTCC 和玻璃。
刀片厚度
刀片厚度
從 75 µm 到 2500 µm
鑽石顆粒大小
從 3 µm 到 250 µm
| Diamond grit size (µ) | Product | Material | Matrix |
|---|---|---|---|
| 35 up to 53 | Ceramic Packages, Sensors | Alumina / AlN | C02/C07 |
| 53 up to 88 | QFN (Half Etched Cu) + Wettable QFN (full cut) | Cu leadframe + molding | D02/D07 |
| 53 up to 88 | QFN (Full Cu) | Cu leadframe + molding | E01 |
| 35 up to 53 | DFN (0.3-0.5mm) | Cu leadframe + molding | E31/D02 |
| 53 up to 88 | Wettable QFN First cut | Cu leadframe + molding | P07 |
| 30 up to 45 | SAW Devices, RF Package | HTCC | QKP/C02 |
| 30 up to 53 | CCD / Filter / Lens | Glass / Quartz | QKP/E33 |
| 45 up to 63 | Optical & Electro Optical Components | Sapphire | QKP |
| 30 up to 53 | Passive & Active Devices. Communication Modules | LTCC | QKP |
樹脂結合劑刀片型號描述
