8030 – Fully Automatic Twin Spindle Saw
8030 - High end fully automatic twin spindle saw, packed with features and benefits. Up to 12”...
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Ceramic (Alumina) PACKAGES
ADT offers comprehensive dicing solutions for ceramic including dicing saws, dicing blades and peripheral equipment.
Ceramic (Alumina) Range
Ceramic (Alumina) Dicing Saws Range
7122
Up to 8″ x 8″ products
Silicon wafers, thin-film devices, high-brightness LED, packages, SAW Filters, glass/ silicon sensors, PZT and more
7132
Up to 12” round product
12” X 9” square substrates with frame or 12” X 12” chuck without frame
PCB, QFN and BGA Panels, highbrightness, LED packages, 12” and 8” Silicon Wafers, SAW Filters
7124
up to 8″ x 8″ products
Ceramic substrates, Alumina, Hybrids,
Thick film devices and more
7134
Up to 12” round product,
12” X 9” square substrates
with frame or 12” X 12”
chuck without frame
Ceramic substrates, Alumina, Hybrids, Thick film devices and more
7222
Up to 8” round product
Up to 8” Silicon Wafers
PCB, QFN and BGA multi panels, highbrightness, LED Packages, SAW Filters
7232
Up to 12” round product, or square
chuck 253x243mm with frame
Silicon wafers, thin-film devices, SAW Filters, Silicon Sensors, PZT and more
7234
Up to 12” round product,
or square chuck
253x243mm with frame
Glass, Sapphire and other hard materials, Ceramic substrates, Alumina, Hybrids, thick film devices and more
7224
Compatible with 4” & 5” annular
blades
Up to 8” round products
Ceramic substrates, Alumina, Hybrids, thick film devices and more
Challenges
Chipping (top & back)
Cut perpendicularity
Blade life
Blades for ceramics
Sintered Matrix type
P9
OD Ø
2”, 3”, 4”
Diamond grit size
30 – 88 µm
Thickness
.006”– .012”
(0.15 mm – 0.3 mm)
Feed rate
2 – 20 mm/sec
Spindle speed
2”: 20 – 30 krpm
4”: 10 –15 krpm
Ceramic (Alumina) Dicing Peripherals Range
MANUAL WAFER MOUNTER 966, 966L
Designed for manual mounting of workpieces on tapes
AV-57L Led UV Curing System
Cutting-edge UV LED Curing Machine – Experience new levels of speed and performance.
