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Dicing Blages

SINTERED DICING BLADES

FEATURES

Midrange wear between Resin and Nickel

 

With a slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) dicing blades are best suited for retaining package shape and size in applications such as:

BGA
Soft Alumina
TiC
LTCC
Ferrite

Sintered Dicing Blades

BLADE THICKNESS

From 80 µm to 1500 µm

DIAMOND GRIT SIZE

From 2 µm to 70 µm

SERRATIONS

Serrations available for sintered dicing blades as well as for various edge shapes

Diamond grit size (µ)ProductMaterialMatrix
45 up to 55BGA , LGA (Tape & Tape-less mounting method)FR4, Plastic & MoldingC2/R5
30 up to 50QFN ( Half Etched )Cu leadframe + moldingQ7/C1
35 up to 45Passive & Active Devices. Communication ModulesLTCCP1/P9
35 up to 45SAW Devices, RF PackageHTCCP1
13 up to 25Camera ModuleGlass/ IR GlassP1/P5
25 up to 45Ceramic PackagesAluminaP5/P9
METAL Bond SINTERED Dicing BLADES

METAL SINTERED DICING BLADES PART NUMBER DESCRIPTION

METAL Bond SINTERED Dicing BLADES

 

NOVUS – METAL SINTERED DICING BLADES PART NUMBER DESCRIPTION