ELECTROPLATED NICKEL DICING BLADES
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Nickel Dicing Blades Features
THE NICKEL BINDER
Hard bond for soft material.
The Nickel binder provides longer dicing blade life and lower wear rate.
Together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as: PCB, Silicon and BGA
BLADE THICKNESS
From 50 µm (2 mil) to 300µm (12 mil)
DIAMOND GRIT SIZE
From 3 µm to 50 µm
SERRATIONS
Serrations available for Nickel dicing blades as well as for various edge shapes
| Diamond grit size (µm) | Product | Material | Matrix |
|---|---|---|---|
| 30 up to 50 | Ceramic / Capacitors | Green Ceramic | BLB/BL0 |
| 10 up to 30 | PCB / LED Package | FR4 / Epoxy & Cu | BLZ, BLV, BLT |
| 6-8 up to 10 | Medical Ultrasound Sensors | PZT | A0T |
| 2-4 up to 4-8 | IC's | Silicon | Hub blades |
Steel Core Nickel Dicing Blades
THE NICKEL BINDER
Best suited for applications such as Green Ceramic, BGA (Tape process).
Only the rim (the cutting edge of the blade) is composed of nickel and diamonds
BLADE THICKNESS
from 300µm to 750µm
DIAMOND GRIT SIZE
From 10µm to 70µm
SERRATIONS
Serrations available for Steel Core Nickel dicing blades as well as for various edge shapes
| Diamond grit size (µm) | Product | Material | Matrix |
|---|---|---|---|
| 30 up to 50 | Ceramic / Capacitors | Green Ceramic | BLB/BL0 |
| 10 up to 30 | PCB / LED Package | FR4 / Epoxy & Cu | BLZ, BLV, BLT |
| 6-8 up to 10 | Medical Ultrasound Sensors | PZT | A0T |
| 2-4 up to 4-8 | IC's | Silicon | Hub blades |
NICKEL BOND DICING BLADES PART NUMBER DESCRIPTION
