LED packaging usually consists of a base substrate upon which the LEDs are mounted.

Common base substrates in the market are: Ceramic, PCB and EMC/MLF.

Major Dicing Considerations:

• Chipping
• Cracks
• Copper burrs
• Die size stability
• Low blade wear
  
  

Dicing Saw:

7132 or 7900LA , Automation and quality control, automatic vision capabilities for multi panel using large area cutting chuck

Dicing Blade and Process Parameters:

ADT developed a dicing solution tailored to the specific package type: 

Ceramic, PCB and EMC/MLF