HIGHLIGHTS | 8030

8030 Dicing Saw Advantages

• Large Chuck Table – Up to 12” round product, or square chuck 12”x12”
• Flexibility – Supports Hub and Hubless blades up to 3” O.D.
• Spindles of 1.8 KW or 2.2 KW high power
• Intuitive operation interface using a large 19” touch screen monitor
• Additional 17” monitor for maintenance comfort

Dicing Applications

• Silicon wafers / discrete devices
• Silicon carbide (SiC)
• MEMS
• SAW devices
• Glass wafer
• Packaging (QFN, LED…)

Features

• Twin spindles 2”- 3”
• UV LED station
• Magazine can stack up to 2 magazines up to 25 frames
• Cleaning unit – wash & dry

Optional

• Brush + high pressure jets
• Pressure jet
• Atomizing jet

Additions (optional)

• BARCODE item identification
• Ionizer Bar – ESD discharge
• SECS / GEM platform ready
• Inline Deburring Brush
• HMT – Height measurement tool
• LMS – Laser mapping system